Award Data

Next-generation intelligent engines will operate at higher temperatures for increased efficiency and will migrate from centralized to distributed control. There is critical need for sensors for operation at ultra-high temperatures (3000F). Conven...

Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...

Busek Co. Inc. and The University of Notre Dame propose to develop room-temperature ionic liquids (ILs) that are robust, non-volatile, transparent, radiation hard, and atmospherically tolerant for use in electrolytes for reversible electroplating applica...

Global Circuit Innovations (GCIs) die extraction and reassembly technology(DER) generated initial interest in and demand by the commercial industry through demonstrating the value of remanufacturing an original integrated circuit (IC) from a plas...

Toyon Research Corp. and the Penn State Univ. propose research and development of innovative algorithms for classifying objects and activities observed in high-dimensional data extracted from multi-sensor motion imagery. The proposed algorithms include novel feature clustering techniques to enable effective characterization of intra-class and inter-class appearance variations in datasets containin ...

Automatic target recognition (ATR)the identification of a potential target based on signatures in sensor datais fundamentally a question of information content. While ATR has been studied for decades, it remains a challenge because multifarious tar...

Triton is proposing to develop a family of preceramic polymers and polymer formulations that will produce group 4 (Zr and Hf) carbides and carbide/boride mixtures in good yield. The target yield for the program is 60 vol%. The goal is to develop material...

Tensile-strained germanium tin structures will be developed for infrared emitters and detectors that are compatible with silicon fabrication processes.Optical detectors in the wavelength range of 2-5 microns will be developed by using GeSn on silicon ...

Advanced infrared imaging techniques are of great interest but associated high costs of III-V and II-VI SWIR and MWIR materials prohibit their widespread deployment and integration with other optoelectronic devices. Freedom Photonics and its team partner...

In this Phase 1 proposal, Vuronyx Technologies in collaboration with Georgia Institute of Technology, Atlanta (GT) intends to fabricate composite panels using high strength and high modulus carbon fibers synthesized from polyacrylonitrile (PAN) precursor...