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The Award database is continually updated throughout the year. As a result, data for FY23 is not expected to be complete until September, 2024.
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Intelligent and Multiplexable Ultra-High-Temperature Fiber-Optic Pressure Sensors for Robust Distributed Engine ControlSBC: INTELLIGENT FIBER OPTIC SYSTEMS CORP Topic: AF16AT18
Next-generation intelligent engines will operate at higher temperatures for increased efficiency and will migrate from centralized to distributed control. There is critical need for sensors for operation at ultra-high temperatures (3000F). Conven...STTR Phase I 2016 Department of DefenseAir Force
SBC: Global Aerospace Corporation Topic: AF16AT24
The Air Force is interested in developing technology that would enable long duration hypersonic flight with reusable aircraft. Hypersonic flow presents many design challenges that can be encapsulated into an aerothermoelastic problem, i.e., a complex dyn...STTR Phase I 2016 Department of DefenseAir Force
SBC: HYPERCOMP INC Topic: AF14AT07
In this program, HyPerComp and University of Michigan have teamedtogether to develop a high-order grid generator for Euler and viscousmeshes. The grid generator is based on HyPerComps successful generalpurpose CAD2Mesh software and is being integrated with HyPerCompsHDphysics and U. Michigans XFlow DG high-order solvers. High-order gridgeneration methods are being implemented to accurately capture ...STTR Phase II 2016 Department of DefenseAir Force
SBC: TRITON SYSTEMS, INC. Topic: AF16AT26
Triton is proposing to develop a family of preceramic polymers and polymer formulations that will produce group 4 (Zr and Hf) carbides and carbide/boride mixtures in good yield. The target yield for the program is 60 vol%. The goal is to develop material...STTR Phase I 2016 Department of DefenseAir Force
SBC: LONGSHORTWAY INC. Topic: AF15AT35
LongShortWay Inc. and Northeastern University propose a family of feature reduction and ensemble classifier methods based on Principal Component and Dynamic Logic feature clustering algorithms. New methods combine feature clustering with non-linear feature reduction via manifold learning, and bagging, boosting, and stacking ensemble algorithms.STTR Phase II 2016 Department of DefenseAir Force
SBC: GLOBAL CIRCUIT INNOVATIONS INC Topic: AF16AT17
Global Circuit Innovations (GCIs) die extraction and reassembly technology(DER) generated initial interest in and demand by the commercial industry through demonstrating the value of remanufacturing an original integrated circuit (IC) from a plas...STTR Phase I 2016 Department of DefenseAir Force
SBC: SEAKR ENGINEERING, LLC Topic: AF11BT12
The SEAKR team proposes to continue development of the advanced protocol routing system begun in the Phase I effort, to reduce risk toward a flight deployable system for SATCOM assets such as Iridium NEXT. SEAKRs development of the Iridium NEXT modem...STTR Phase II 2016 Department of DefenseAir Force
SBC: CFD RESEARCH CORPORATION Topic: AF16AT14
Next-generation turbulent combustion models must enable accurate prediction of lean blow-out and flashback for complex geometries, fuels and operating conditions relevant to the Air Force. Improved models are needed to better predict kinetically and hydr...STTR Phase I 2016 Department of DefenseAir Force
Environmentally-Compliant Kinetic Metallization Coating Materials for Corrosion and Wear Protection of Military Aircraft and Weapon SystemsSBC: INNOVATIVE TECHNOLOGY INC Topic: AF15AT31
Coating materials and coating methods used to protect U.S. military aircraft and weapon systems from corrosion and wear are in need of environmentally benign alternatives in order to keep up with dynamic regulations associated with environment, safety, and occupational health. Thus, the Air Force is supporting research to develop alternatives to the dangerous materials identified on the OSD Emergi ...STTR Phase II 2016 Department of DefenseAir Force
SBC: MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION Topic: AF16AT17
Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...STTR Phase I 2016 Department of DefenseAir Force