Award Data

Future gas turbine propulsion designs, in addition to incorporating variable geometrical engine features, will require controlling and integrating large power generation/extraction, as well as, managing thermal limits of the components. The engine contro...

We propose to research the feasibility of rapidly reconstituting a ground based sensor system for space situational awareness with a large fraction of the capability of the GEODSS sensor system. This system can be deployed quickly to a GEODSS site where ...

allowing the sensitive RF front-end to be located away from the now more compact phased array antenna. We are proposing a rugged photonic integrated spatial division multiplexing RF link for phased array system with low cost, size, weight and power cons...

In this program, HyPerComp and University of Michigan have teamedtogether to develop a high-order grid generator for Euler and viscousmeshes. The grid generator is based on HyPerComps successful generalpurpose CAD2Mesh software and is being integrated with HyPerCompsHDphysics and U. Michigans XFlow DG high-order solvers. High-order gridgeneration methods are being implemented to accurately capture ...

We propose to develop a 3D tomographic background-orientated Schlieren measurement technique, including hardware setup and post-processing software to produce 3D visualization of compressible flow features in subsonic, transonic, and supersonic wind tunn...

This work will focus on the development of monolithic SWIR focal plane array technologies using CMOS or CMOS compatible fabrication technology. This will be realized on a Silicon substrate and incorporate APD+TIA arrays and be scalable to Megapixel arrays and coherent receiver operation for capture of the full optical wavefront vector information.

Next-generation intelligent engines will operate at higher temperatures for increased efficiency and will migrate from centralized to distributed control. There is critical need for sensors for operation at ultra-high temperatures (3000F). Conven...

Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...

Global Circuit Innovations (GCIs) die extraction and reassembly technology(DER) generated initial interest in and demand by the commercial industry through demonstrating the value of remanufacturing an original integrated circuit (IC) from a plas...

This program will develop and analyze a design for a high performance, low cost, one-person-mobile telescope, mount, and camera to track space debris. It will use an innovative optical design, unique optical fabrication technology, and a novel mirror bl...