Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics

Award Information
Agency:
National Aeronautics and Space Administration
Amount:
$100,000.00
Program:
SBIR
Contract:
NNX10CE23P
Solitcitation Year:
2009
Solicitation Number:
N/A
Branch:
N/A
Award Year:
2010
Phase:
Phase I
Agency Tracking Number:
094940
Solicitation Topic Code:
S5.05
Small Business Information
Sienna Technologies, Inc.
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072-4423
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
015577190
Principal Investigator
 Ender Savrun
 Principal Investigator
 (425) 485-7272
 ender.savrun@siennatech.com
Business Contact
 Karen Valdastri
Title: Business Official
Phone: (425) 485-7272
Email: karen.valdastri@siennatech.com
Research Institution
N/A
Abstract
The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500ºC in extreme environments of space exploration. The Phase I program will demonstrate a reliable direct bond copper (DBC) process for Si3N4 substrates, develop high current carrying hermetic feedthroughs, an innovative transient liquid phase (TLP) die attach, and a monometallic wire bonding capable of reliable operation above 500ºC; and fabricate and test a hermetic single-chip module.

* information listed above is at the time of submission.

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