A Reliable Electronic Package for Space Exploration

Award Information
Agency:
National Aeronautics and Space Administration
Branch:
N/A
Amount:
$600,000.00
Award Year:
2010
Program:
SBIR
Phase:
Phase II
Contract:
NNX10RA23C
Agency Tracking Number:
075216
Solicitation Year:
2007
Solicitation Topic Code:
X1.03
Solicitation Number:
N/A
Small Business Information
Sienna Technologies, Inc.
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072-4423
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
015577190
Principal Investigator
 Ender Savrun
 Principal Investigator
 (425) 485-7272
 ender.savrun@siennatech.com
Business Contact
 Karen Valdastri
Title: Business Official
Phone: (425) 485-7272
Email: karen.valdastri@siennatech.com
Research Institution
N/A
Abstract
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes that were developed in Phase I to assemble the components into a hermetically sealed package will be used to package SiGe operational amplifiers. Process and materials reliability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module packages.

* information listed above is at the time of submission.

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