Z-Fiber for Improved Through Thickness Thermal Conductivity of MMC's

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$68,916.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
F3060203C0201
Agency Tracking Number:
031-0892
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
AZTEX, INC.
360 Second Avenue, Waltham, MA, 02451
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
837612506
Principal Investigator:
John Harris
Director of Engineering
(781) 622-5529
jharris@aztex-z-fiber.com
Business Contact:
Anthony Bonnington
President
(781) 622-5531
tbonning@aol.com
Research Institution:
n/a
Abstract
Aztex has developed a technology to reinforce composites called Z-Fiberr insertion. Normally standard carbon fiber pins are inserted through the thickness of an uncured carbon prepreg laminate using ultrasonic energy. The resulting product has superiordamage tolerance. It is possible to adapt this process to use thermally conductive pins and to insert them in the Z direction through a pitch based precursor prior to infiltration of the precursor. We expect that the result will be to produce an MMC platewhich will have excellent x, y and Z thermal properties. Aztex will team with MMCC to research this concept. Aztex will refine the insertion technology and MMCC will make the final plates and measure the thermal properties. MDA are seeking innovativeapproaches to improve baseline technologies. A particular problem is thermal management for concentrated local heat sources. Typically through the thickness, i.e. Z properties are not so good as x/y properties. Aztex has a proven concept that is alreadybeing used on the F/A 18 E/F aircraft when multiple carbon fiber pins are being inserted using Ultrasonics through the thickness of composite structure. It is anticipated that if thermally conductive pins are used the thermal properties of an MMC laminatecan be substantially improved. Aztex already has a proven track record of commercialization.

* information listed above is at the time of submission.

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