Contamination-free, Ultra-rapid Reactive Chemical Mechanical Polishing (RCMP) of GaN substrates

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$100,000.00
Award Year:
2010
Program:
STTR
Phase:
Phase I
Contract:
HQ0006-10-C-7396
Agency Tracking Number:
B09B-001-0065
Solicitation Year:
n/a
Solicitation Topic Code:
MDA 09T001
Solicitation Number:
n/a
Small Business Information
Sinmat Inc
2153 Hawthorne Road, GTEC Center, Suite 129, Box2, Gainesville, FL, 32641
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
024935517
Principal Investigator:
Rajiv Singh
Professor of Mat. Sc. & Eng.
(352) 246-7420
rsing@mse.ufl.edu
Business Contact:
Deepika Singh
President and CEO
(352) 334-7237
singh@sinmat.com
Research Institution:
University of Florida
Rajiv K Singh
Material Science & Engineering
PO Box 116400
Gainesville, FL, 32611
(352) 246-7420
Nonprofit college or university
Abstract
Gallium Nitride (GaN) substrates are ideal materials for fabrication of high-power and high-frequency devices based on III-V materials. The current state-of-the-art Chemical Mechanical Polishing (CMP) methods are plagued by several challenges, including, surface charge affects due to surface contamination, and sub-surface damages, which can limit the quality of III-V devices. Furthermore, there is a need to enhance polishing rates to increase throughput and decrease manufacturing costs. Sinmat Inc., in collaboration with University of Florida proposes to develop a surface contamination-free, Ultra-rapid Reactive Chemical Mechanical Polishing (RCMP) process for the production of epi-ready GaN substrates. This process also facilitates removal of surface/ sub-surface damage that can be detrimental to epitaxial growth. In Phase I we plan to demonstrate the feasibility of this RCMP process for polishing GaN substrates, whereas in Phase II high performance electronic devices will be fabricated on such GaN substrates.

* information listed above is at the time of submission.

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