Ultra-Rapid Chemical Mechanical Finishing (UCMF) of SiC Mirrors

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-10-C-7276
Agency Tracking Number: B083-017-0622
Amount: $799,994.00
Phase: Phase II
Program: SBIR
Awards Year: 2010
Solicitation Year: 2008
Solicitation Topic Code: MDA08-017
Solicitation Number: 2008.3
Small Business Information
2153 SE Hawthorne Road, GTEC Center, Suite 129, Box 2, Gainesville, FL, 32641
DUNS: 024935517
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Deepika Singh
 (352) 334-7237
Business Contact
 Deepika Singh
Title: President
Phone: (352) 334-7237
Email: singh@sinmat.com
Research Institution
The overall goal of the Phase II effort is to develop the novel ultra-rapid chemical mechanical finishing (UCMF) process for SiC mirror manufacturing, and commercialize this process in collaboration with existing vendors using existing equipment infrastructure. Unlike glass and metallic systems, the high hardness and chemical inertness of SiC currently limit the finishing of SiC mirrors to mechanical polishing processes that rely on diamond based slurries. Such processes are characterized by low removal rates and large sub-surface damage that results in multiple step finishing processes. The UCMF technology uses chemical assisted polishing process that rapidly removes SiC by chemically reacting with the surfaces, thereby resulting in ultra- smooth surface finish, and significantly reduced sub-surface damage. The UCMF process has the potential to reduce the processing times and decrease the number of finishing steps, thereby resulting in significant cost and time savings. Sinmat estimates that the successful integration of its UCMF process by existing vendors will result in 50% to 80% savings in SiC mirror finishing processes based on the enhanced removal rates and decrease in processing steps. Sinmat estimates that this project will reach TRL 6/7 levels by the completion of the Phase II program.

* Information listed above is at the time of submission. *

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