SBIR Phase I: High Speed Flexible Printed Circuit (FPC)

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0637277
Agency Tracking Number: 0637277
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2007
Solicitation Year: 2006
Solicitation Topic Code: MI
Solicitation Number: NSF 06-553
Small Business Information
2953 Bunker Hill Lane, Suite 400, Santa Clara, CA, 95054
DUNS: 125981485
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Achyut Dutta
 PhD
 (408) 282-3628
 akdutta@banpil.com
Business Contact
 Achyut Dutta
Title: PhD
Phone: (408) 282-3628
Email: akdutta@banpil.com
Research Institution
N/A
Abstract
The Small Business Innovation Research (SBIR) Phase I Project will investigate an innovative high-speed Flexible Printed Circuit (FPC) utilizing conventional material (like Polyimide) and standard manufacturing process. With the continued growth in integration density of CMOS (complementary metal-oxide semiconductor) technology and clock frequency of chips, the aggregate bandwidth required between future-generation chip and chipsets will increase sharply. Driving serial or parallel data at high speed over conventional flexible board (i.e. flexible) is becoming a severe design constraint in many applications. Today, divding high speed signal into several low speed signals and driving those signals in parallel are common. Utilizing this technique will not fully utilize the chip speed and thereby overall system performance will not be improved siginificantly. The proposed technology will produce the high speed FPC which will have high signal carrying capacity. Utilizing such FPC will help to increase the system performance significantly. The objectives of the project are to identify the best structural configuration and its optimization, to design the polymer-based FPC, and to establish the feasibility of high speed FPC board. In this project, prototypes will be made and evaluated, measurements of relevant characteristics will be conducted, and a development path for the next phase of the project will be identified. The project has the potential to produce the high speed interfaces suitable for next generation digital and RF system applications. The direct commercial potential of the project lies in interface products, manufactured using this technology for HDTV, flat-panel display, networking equipments, imaging and video systems, etc.

* Information listed above is at the time of submission. *

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