Low Cost InGaN Device Production and HOVPE Tool

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$749,999.00
Award Year:
2010
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-11-C-0080
Award Id:
91833
Agency Tracking Number:
08SB2-0814
Solicitation Year:
n/a
Solicitation Topic Code:
DARPA 08-053
Solicitation Number:
n/a
Small Business Information
Structured Materials Industries (Currently Structured Materials Industries, Inc.)
201 Circle Drive North, Unit # 102, Piscataway, NJ, 08854
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
787144807
Principal Investigator:
Gary Tompa
President
(732) 302-9274
gstompa@structuredmaterials.com
Business Contact:
Gary Tompa
President
(732) 302-9274
gstompa@structuredmaterials.com
Research Institution:
n/a
Abstract
InGaN and the related group III-Nitride semiconductors are important for a range of electronic device applications, spanning lasers, LED's, photovoltaics, detectors, and high speed / high power devices. Present production technologies such as MOCVD and MBE are too slow and too expensive for commercial production of all but the most high-end products. In this Phase II SBIR effort, Structured Materials Industries, Inc. (www.structuredmaterials.com (SMI)) will solve the speed and cost limitations in today's nitride device making - we will build a further scalable pilot hybrid HVPE/OMVPE- HOVPE production tool for InGaN and related materials, capable of low cost and high volume material and device production. In Phase I, we exceeded our proposed proof of concept of the technology - demonstrating technical feasibility and resolving several issues. In Phase II, we will implement our patent pending design at pilot production scale, demonstrating product capabilities by producing photovoltaic and LED devices exhibiting multiple indium content (through >5%) and we will refine our cost model, and extend our production pathway(s) of both the tool and of low cost devices. In the process we will establish a tool and material demonstration capability in our applications lab and we will establish product manufacturing for Phase III sale.

* information listed above is at the time of submission.

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