Advanced Cooling Methods for Film Capacitors

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911QX-10-C-0042
Agency Tracking Number: A093-139-1163
Amount: $69,974.00
Phase: Phase I
Program: SBIR
Awards Year: 2010
Solicitation Year: 2009
Solicitation Topic Code: A09-139
Solicitation Number: 2009.3
Small Business Information
1046 New Holland Avenue, Lancaster, PA, 17601
DUNS: 126288336
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 David Sarraf
 Principal Investigator
 (717) 295-6061
 dave.sarraf@1-ACT.com
Business Contact
 Jon Zuo
Title: President
Phone: (717) 295-6058
Email: jon.zuo@1-ACT.com
Research Institution
N/A
Abstract
Power inverters convert electrical power from one voltage and frequency to another. They are used in a variety of commercial and military systems, including electric vehicles, solar and wind energy power conditioning, and More Electric Aircraft. The ability to effectively cool the capacitors in these inverters is limiting the maximum operating temperature and packaging density of the inverters. Current practice is to reject heat axially, from the base of the capacitor to a mounting plate. This results in large temperature gradients and limits capacitor performance. This Phase I program will investigate cooling the capacitors radially, using a high-conductivity thermal link to bring the heat to the base plate. Finite Element analysis has shown that this approach allows higher capacitor power dissipation before reaching a limiting dielectric temperature and eliminates local hot spots that can lead to early failure. Effective capacitor cooling will allow reduction in the number of capacitors used and use of coolants operating at higher temperatures. It will also allow the use of COTS components, such as commercially-available, unmodified capacitors, with their proven high reliability and known characteristics. Phase II will construct and demonstrate one or more inverters using this radial cooling technology in relevant environments.

* Information listed above is at the time of submission. *

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