LHP Architecture and Advanced Wicks for Freeze Tolerance

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,935.00
Award Year:
2010
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-10-M-0142
Award Id:
97245
Agency Tracking Number:
F093-079-0601
Solicitation Year:
n/a
Solicitation Topic Code:
AF 09-079
Solicitation Number:
n/a
Small Business Information
133 Defense Highway, Suite 212, Annapolis, MD, 21401
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
153908801
Principal Investigator:
StevenSeghi
Group Manager
(410) 987-3435
zimbo@techassess.com
Business Contact:
SharonFehrenbacher
CEO
(410) 224-3710
sharon@techassess.com
Research Institute:
n/a
Abstract
This proposal describes a freeze-tolerant water loop heat pipe (LHP) as the solution to the spacecraft high temperature electronics thermal removal and transportation problem when operating between 100oC-200oC. Water LHPs -- owing to their many favorable system attributes that include high conductance, passive operation, operating temperature applicability, compactness, heat load/transport length scalability, integration flexibility, low mass, no-moving-part reliability, low cost, benign nature, and dual-use potential -- are uniquely suited to meeting the high temperature electronics thermal management system technology objectives. Water is a desirable choice of working fluid not only because of its excellent thermal properties but it is a fluid that is accepted from a safety perspective which would allow it to be used in a wide variety of applications, including commercial electronics. Unfortunately, despite the promise of water LHPs, their freeze-tolerance remains a critical problem that must be solved to ensure long-life operation in warm/cold environments. The technology proposed herein will result in a freeze-tolerant water loop heat pipe. BENEFIT: In addition to the solicitation topic of cooling for spacecraft high temperature electronics, additional post applications for the freeze-tolerant water LHP technology include, but are not limited to, the following ground/space applications: (1) commercial PC cooling (CPU, video cards, etc); (2) industrial electronics (3) Hybrid electric vehicle (HEV) component cooling; (4) commercial aircraft electronics cooling; (5) avionics cooling in military aircraft; (6) military hybrid vehicle cooling; and (7) others.

* information listed above is at the time of submission.

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