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Stable Panels Incorporating a Network of Distortion Lowering Evaporators
Title: Group Manager
Phone: (410) 987-8988
Phone: (410) 224-3710
This proposal describes a novel idea to achieve a thermally stable panel (TSP) through the coupled use of: (1) a two dimensional evaporator array hybrid loop heat pipe system, which enables component or environment power transients to be spatially leveled via evaporator heat load sharing; (2) use of sheet metal forming technology, which enables a complex evaporator flow network to be formed into a thin, bondable, hermetically-sealed layers instead of using tubing for transport lines and headers; and (3) low thermal expansion composite isogrid panels, which provides a low stress/low distortion foundation for payload mounting. The Phase I project will design, fabricate and test a breadboard system consisting of a four evaporator sheet network and a condenser. The breadboard system will be analytically modeled and the results compared to experimental testing. BENEFIT: The approach is a low cost solution to achieving lightweight, low distortion panels for mounting satellite sensors. The concept may be adaptable to providing thermal stabilization of precision optical mirrors.
* Information listed above is at the time of submission. *