Thermal Control Spacecraft Panel

Award Information
Department of Defense
Air Force
Award Year:
Phase I
Award Id:
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
AF 09-074
Solicitation Number:
Small Business Information
780 Eden Road, Lancaster, PA, 17601
Hubzone Owned:
Minority Owned:
Woman Owned:
Principal Investigator:
Mark Montesano
Vice President of Engineering
(631) 285-6580
Business Contact:
Adam Rosen
General Mgr./Senior Vice President
(215) 375-3035
Research Institution:
The thermal environment for satellites operating in low Earth orbit varies significantly through the course of a single orbit and throughout its lifetime as the beta angle varies over time. In addition, the operation of many satellite payloads in LEO is highly transient. The combination of environmental extremes and payload duty cycle frequently results in time varying thermal distortions, which can result in degraded performance or complete mission failure in the worst case. k Technology proposes a technology development of a material panel concept combining two innovative technologies: encapsulated annealed pyrolytic (APG); and a thermally enhanced phase change material (TEPCM). Aluminum encapsulated APG is a composite material with five times the conductivity of aluminum. The thermally enhanced TEPCM is an innovative PCM composite using APG platelets as the reinforcement phase. The combination of these two technologies will enable both the thermal management of the steady state heat load conditions as well as the transient peak loads as defined above. This thermally stable panel design for highly transient spacecraft payloads will permit the reliable operation of radar and similar space systems in the challenging space environment. BENEFIT: The high conductance and temperature leveling capability of the material to be demonstrated under this program would have immediate applications in AF systems, as well as other military, NASA, and commercial uses. Key potential post application relies heavily on the successful verification and certification of the proposed materials' performance. With increasing acceptance, the technology will be attractive to automotive and power supply manufactures. Enabling technologies will allow the increase of production and the realization of the economies of scale. At this level, one can only estimate the potential impact on the personal computer and other high volume heat sensitive products.

* information listed above is at the time of submission.

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