Hyperspectral 3D Imager
Small Business Information
BODKIN DESIGN & ENGINEERING, LLC
P.O. Box 81386, Wellesley, MA, 02481
Andrew Sheinis Ph.D.
AbstractWe propose a new hyperspectral imaging technique based on a novel optical processor. The optical processor allows for the unprecedented capture of all three dimensions (two spatial and one spectral) of the data cube simultaneously. The primary military application for this staring hyperspectral imager is as a high-resolution discriminator cued by a broad-area search sensor, such as Space-Based Radar (SBR). The proposed system is envisioned as an adjunct system that uses high-resolution spectral and spatial information to improve the probability of detection and reduce the false-alarm rate of the cueing sensor.
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