Materials and Processing System for the Economic Production of Single-Wall Carbon Nanotube Thin-Film Transistors

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-09-C-0127
Agency Tracking Number: 08SB2-0324
Amount: $98,998.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2008
Solicitation Topic Code: SB082-014
Solicitation Number: 2008.2
Small Business Information
2401 Brewer Drive, Rolla, MO, 65401
DUNS: 019689330
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Wu-Sheng Shih
 Scientist
 (573) 364-0300
 wshih@brewerscience.com
Business Contact
 Tony Flaim
Title: Chief Technical Officer
Phone: (573) 364-0300
Email: tflaim@brewerscience.com
Research Institution
N/A
Abstract
In this Phase I SBIR program, Brewer Science, Inc. (BSI), a leader in innovative microelectronic materials, and our pioneering additive manufacturing partner will develop and demonstrate a cost-effective materials production process for fabricating high-performance thin-film transistors (TFTs) using single-wall carbon nanotubes (SWCNTs) and manufacturing-scalable direct printing technology. In recent years, high-performance SWCNT-based transistors have been successfully produced on a laboratory/research scale. The techniques used in those efforts, however, are not readily adaptable to low-cost commercial-scale manufacturing. For SWCNT devices to become commercially viable, manufacturing techniques must be developed that are low cost, efficient, reliable, and readily adaptable to a wide range of devices. BSI’s proposed effort is based on technologies and processes that have been conceived and partially developed within BSI laboratories with a succinct focus on commercial manufacturability. Our proposed technology is expected to lead to surfactant-free, type-enriched SWCNT solutions that can be directly printed onto flexible or rigid substrates using high-speed and commercially demonstrated aerosol-jet printing technologies to produce high-performance miniaturized electronic devices.

* Information listed above is at the time of submission. *

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