STTR Phase I: Electronically Tunable RF Passives on Planar Multi-Layer Metamaterials

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0539198
Agency Tracking Number: 0539198
Amount: $99,939.00
Phase: Phase I
Program: STTR
Awards Year: 2006
Solitcitation Year: 2005
Solitcitation Topic Code: EL
Solitcitation Number: NSF 05-557
Small Business Information
1026 Sean Circle, Darien, IL, 60561
Duns: N/A
Hubzone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Jesse Castaneda
 (630) 724-0596
Business Contact
 Angela Yang
Phone: (630) 724-0596
Research Institution
 Univ of IL Chicago
 Hung Y Yang
 809 Marshfield
Chicago, IL, 60612
 (312) 996-0675
 Nonprofit college or university
This Small Business Technology Transfer (STTR) Phase I project investigates a new type of electronically tunable RF passives for reconfigurable multi-band and multi-function RF front end radio systems. The front-end passives including antennas, filters, baluns, and transmission line inductors and capacitors are printed on an engineered metalized material (meta-materials) made on common printed-circuit multiple metal-dielectric layer structures. By tuning the injected currents on meta-material, it could be possible to adjust material characteristics and as a result, the central frequency and operating band of a passive component. The design of such an electronically tunable system requires a rigorous electromagnetic analysis of passive components, meta-materials, and their interactions. The desired planar meta-materials are compact in size with the metal profile resonant frequencies close to the device frequencies. The entire tunable system design requires the modeling of electromagnetic coupling between components and meta-materials and involves a three-dimensional field analysis of the complete structure. Wireless communication technology and applications have seen tremendous growth in recent years. Present wireless technology is geared toward the consolidation of multiple networks into one communication system for global roaming. There is an ever increasing demand for broadband multimedia applications for personal communication systems (PCS) that are extremely compact in size with multiple functionalities. A compact and power efficient implementation of multi-standard and multi-functional system calls for a tunable or reconfigurable RF front-end that is completely integrated with the rest of the system on circuit boards. RF passives on the circuit board (outside the chips) remain the bottleneck for device miniaturization and reconfiguration.

* information listed above is at the time of submission.

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