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Fabrication of Ta-Hf-C-based Ultra High Temperature Composites via a

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-10-C-7394
Agency Tracking Number: B09B-002-0004
Amount: $99,979.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA09-T002
Solicitation Number: 2009.B
Timeline
Solicitation Year: 2009
Award Year: 2010
Award Start Date (Proposal Award Date): 2010-05-03
Award End Date (Contract End Date): 2010-11-02
Small Business Information
4401 Dayton-Xenia Road, Dayton, OH, 45432
DUNS: 074689217
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 HeeDong Lee
 Research Scientist
 (937) 426-6900
 hdlee@ues.com
Business Contact
 Bryce Skinn
Title: Business Relations Manager
Phone: (937) 426-6900
Email: bskinn@ues.com
Research Institution
 University of Aabama
 Gregory B Thompson
 Dept. of Met. & Mat. Eng.
Tuscaloosa, AL, 35487
 (205) 348-1589
 Nonprofit college or university
Abstract
This Phase I STTR program seeks a new fabrication method to produce stronger (>100 kpsi) and tougher (>10 MPa m1/2) ultra high temperature Ta-Hf-C-based composites (UHTC) with an outstanding oxidation resistance for use as thermal protection systems for hypersonic applications, as well as for advanced rocket nozzle throat components. UES will apply a novel "Top Down" approach to control the microstructures of the composites. This approach will produce a very unique grain structure that can offer high strength, high fracture toughness, and high oxidation resistance. Hot-pressing will be used as a means for densification during the Phase I feasibility study. In the Phase II work, a sinter/HIP process will be explored for near-net shape fabrication. During the Phase I program, UES will collaborate with the University of Alabama to evaluate oxidation mechanisms and to conduct microstructural characterization. UES will process the powders and will also evaluate the mechanical properties.

* Information listed above is at the time of submission. *

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