MULTI-GIGAHERTZ BANDWIDTH HIGH PINOUT DENSITY WAFER PROBE

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 9530
Amount: $49,866.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1989
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
14255 Sw Brigadoon Ct - Ste C, Beaverton, OR, 97005
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Eric W Strid
 (503) 626-8245
Business Contact
Phone: () -
Research Institution
N/A
Abstract
A MEMBRANE TYPE WAFER PROBE IS PROPOSED WHICH, AT THE END OF PHASE II, WILL ACHIEVE TRANSMISSION OF SIGNALS FROM TESTER TO DIE WITH LOW ABBRATIONS FOR A 100 PS RISETIME. CAPABILITIES WILL INCLUDE LOW-IMPEDANCE GROUND AND POWER CONTACTS, WITH LSI-LEVEL NUMBERS AND DENSITIES OF SIGNAL LINES. PHASE I WORK WILL DETERMINE THE DESIGN PARAMETERS NECESSARY FOR THESE GOALS THROUGH A SEQUENCE OF CALCULATIONS, SCALE MODELLING, AND PROTOTYPE FABRICATION AND TESTING.

* Information listed above is at the time of submission. *

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