MULTI-GIGAHERTZ BANDWIDTH HIGH PINOUT DENSITY WAFER PROBE

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$49,866.00
Award Year:
1989
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
9530
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Cascade Microtech Inc
14255 Sw Brigadoon Ct - Ste C, Beaverton, OR, 97005
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Eric W Strid
(503) 626-8245
Business Contact:
() -
Research Institution:
n/a
Abstract
A MEMBRANE TYPE WAFER PROBE IS PROPOSED WHICH, AT THE END OF PHASE II, WILL ACHIEVE TRANSMISSION OF SIGNALS FROM TESTER TO DIE WITH LOW ABBRATIONS FOR A 100 PS RISETIME. CAPABILITIES WILL INCLUDE LOW-IMPEDANCE GROUND AND POWER CONTACTS, WITH LSI-LEVEL NUMBERS AND DENSITIES OF SIGNAL LINES. PHASE I WORK WILL DETERMINE THE DESIGN PARAMETERS NECESSARY FOR THESE GOALS THROUGH A SEQUENCE OF CALCULATIONS, SCALE MODELLING, AND PROTOTYPE FABRICATION AND TESTING.

* information listed above is at the time of submission.

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