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Integrated Silicon Carbide Power Electronic Block

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-SC0015991
Agency Tracking Number: 224104
Amount: $149,951.74
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 14
Solicitation Number: DE-FOA-0001417
Timeline
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-06-13
Award End Date (Contract End Date): 2017-03-12
Small Business Information
20692 Prism Place
Lake Forest, CA 92630-7803
United States
DUNS: 078740725
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Rahul Radhakrishnan
 Dr.
 (949) 216-8478
 rahulrad@gmail.com
Business Contact
 Richard Woodin
Title: Dr.
Phone: (949) 216-8790
Email: rwoodin@gptechgroup.com
Research Institution
N/A
Abstract

Advances in silicon carbide (SiC) MOSFETs promise to revolutionize power electronics,
including for transportation. Adoption of SiC power devices in electric vehicle drives is hindered
by high cost and unproven reliability in vehicle applications. Statement of how this Problem or Situation is Being Addressed Fabrication of low on-resistance, high performance SiC DMOSFETs and monolithically
integrated DMOSFET-JBS diodes on 150 mm wafers using an area-efficient integrated design
will reduce device cost to parity with incumbent silicon power devices and speed adoption of this
exciting new technology. Commercial Applications and Other Benefits Silicon carbide semiconductor devices are predicted to become a $1B industry by 2023.
Adoption of a new technology requires technical capability, competitive price and confidence in
reliability. Extensive reliability testing will improve confidence in silicon carbide technology
and accelerate adoption of SiC devices. Key Words Silicon Carbide, SiC, MOSFET, JBS Diode, Semiconductor

* Information listed above is at the time of submission. *

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