In Situ Metrology for the Corrective Polishing of Replicating Mandrels

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX10CD72P
Agency Tracking Number: 094696
Amount: $99,314.00
Phase: Phase I
Program: SBIR
Awards Year: 2010
Solicitation Year: 2009
Solicitation Topic Code: S2.05
Solicitation Number: N/A
Small Business Information
3495 Kent Avenue, K100, West Lafayette, IN, 47906-5391
DUNS: 186676446
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Kelchner
 Principal Investigator
 (765) 775-1010
Business Contact
 John Kelchner
Title: Business Official
Phone: (765) 775-1010
Research Institution
The International X-Ray observatory (IXO) is due to be launched in 2021. The core of the instrument is a very large (3.2 meter diameter) Wolter I optic, to be assembled from approximately 13,000 individual elements. Each element will, in turn, be created by 'slumping' glass over a precision mandrel, of which there must be in excess of 700. In addition to the very large size of the mandrels (up to 1.6 meter radius), figure and size tolerances are exceedingly tight, ranging from 2 nanometers (axial figure) to 200 nanometers (radius variation). The combination of size, accuracies, production rate requirements and the number of individual component designs defy standard optical metrology techniques. While polishing equipment that can meet these tolerances exists, the polishers must be controlled by continuous or near continuous (process intermittent) feedback. In this effort we propose to develop a unique "point-defined" metrology instrument that can be incorporated into the polishing machine itself, to control the manufacturing process to the required levels of accuracy. In Phase 1 we will develop conceptual designs for both stand-alone and on-machine instrumentation. In Phase 2 we will develop a stand-alone metrology instrument, and in Phase 3 we will fully incorporate the technology onto a commercial polishing instrument.

* Information listed above is at the time of submission. *

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