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An Additive Manufacturing Technique for the Production of Electronic Circuits

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX16CM40P
Agency Tracking Number: 150158
Amount: $124,663.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: T12.04
Solicitation Number: N/A
Timeline
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-06-10
Award End Date (Contract End Date): 2017-06-09
Small Business Information
259 Cheswick Drive, Madison, AL, 35757-0259
DUNS: 000000000
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Chance Glenn
 Principal Investigator
 (585) 899-0457
 chancemglenn@morningbirdmedia.com
Business Contact
 Chance Glenn
Title: Business Official
Phone: (585) 899-0457
Email: chancemglenn@morningbirdmedia.com
Research Institution
 Alabama A&M RISE Foundation
 Chance Glenn
 4900 Meridian Street
Normal, AL, 35762-4900
 (585) 899-0457
 Domestic nonprofit research organization
Abstract
The proposed 9-month research project aims for the development of additive manufacturing techniques for the creation of electronic devices. It will develop an innovative additive manufacturing technique that combines the ink-based printing with laser melting technology to directly print a three-dimensional (3D) system with built-in electrical properties and functioning as an electronic device. The fundamental electronic device includes the resistor, conductor, semiconductor, insulator and capacitor. This proposed 3D printing technique involves (1) the development of five fundamental ink-based printing materials suitable for conductor, resistor, capacitor, semiconductor and insulator production; (2) the design of the five rotating injectors for five distinct ink-based materials; (3) the development of laser melting technology to provide on-demand melting and solidification of the dispensed ink-based materials; and (4) the evaluation of 3D printing control software.

* Information listed above is at the time of submission. *

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