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Three-Dimensional Control Panel Simulation

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N61339-07-C-0085
Agency Tracking Number: N071-047-0527
Amount: $149,926.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N07-047
Solicitation Number: 2007.1
Solicitation Year: 2007
Award Year: 2007
Award Start Date (Proposal Award Date): 2007-06-25
Award End Date (Contract End Date): 2007-12-25
Small Business Information
727 Airport Boulevard
Ann Arbor, MI 48108
United States
DUNS: 197187602
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Douglas Haanpaa
 Research Engineer
 (734) 668-2567
Business Contact
 Charles Jacobus
Title: President
Phone: (734) 668-2567
Research Institution

The Navy requires a virtual haptic instrument panel device that can faithfully replicate the look and feel of aircraft instrument panels. There are a number of approaches that can be explored to develop a workable technology. These range from rather mundane approaches that utilize existing components to more exotic/innovative approaches that require significant research and experimentation For this application, there are two technology areas that must be addressed. The first is the automated extraction of 3D panel model and texture data. This can be accomplished with image-based modeling or by using active methods like laser range scanning. The second technology area is the device or device-set that presents the panel haptically to the user. Cybernet proposes a multi-tier exploratory research process that evaluates a number of VHIP approaches by first generating a list of possible approaches, and then weeding out the less desirable ones based on a successively increasingly rigorous elimination process steps beginning with paper-evaluation of the initial candidate list and finishing with the evaluation of prototyped hardware. Candidates concepts include Force-feedback gloves, plug-in switch modules, 3D tactile raster displays, instrument carousels, and combination technologies.

* Information listed above is at the time of submission. *

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