Low Cost, High Performance Transmit/Receive Integrated Circuits on a Single Chip

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,987.00
Award Year:
2010
Program:
STTR
Phase:
Phase I
Contract:
HQ0006-10-C-7404
Agency Tracking Number:
B09B-004-0019
Solicitation Year:
n/a
Solicitation Topic Code:
MDA 09T004
Solicitation Number:
n/a
Small Business Information
Versaq
75 Fifth Street NW, Centergy One, Suite 314, Atlanta, GA, 30308
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
792280799
Principal Investigator:
Thomas Backes
Principal Research Engineer
(404) 483-5236
thomas.backes@versaq.com
Business Contact:
Thomas Backes
Principal Research Engineer
(404) 483-5236
thomas.backes@versaq.com
Research Institution:
Georgia Institute of Technology
John Cressler
777 Atlantic Drive NW
Atlanta, GA, 30332
(404) 894-5161
Nonprofit college or university
Abstract
In the proposed effort we plan to build a fully-operational X-band T/R Integrated Circuit. One of the key-elements to building a fully operational radar is the requisite RF electronics that feed to each antenna element. Historically, radar transmit/receive (T/R) modules have been implemented as complex, multi-chip GaAs MMICs, resulting in very high cost per T/R module, high launch weight, and high power dissipation; all of these characteristics are clear disadvantages for weight and size restricted vehicles. Very recently, however, SiGe technology, coupled with the low-power-density array radar system design paradigm has emerged as a viable path in defense radar system design and is rapidly gaining traction. While this low-cost, light-weight radar design paradigm was initially begun as a path forward for next-generation defense ground-based X-band tactical radars, this SiGe radar design methodology is clearly extendable to a variety systems, and will provide compelling advantages for MDA applications, other defense radar systems, and eventually commercial applications as outlined in this proposal.

* information listed above is at the time of submission.

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