Printable Materials with Embedded Electronics and Radio Frequency Components

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-17-P-0121
Agency Tracking Number: A161-006-0868
Amount: $154,999.95
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A16-006
Solicitation Number: 2016.1
Timeline
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-09-15
Award End Date (Contract End Date): 2017-12-09
Small Business Information
1718 Peachtree Street, Atlanta, GA, 30309
DUNS: 796514763
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr. Michael Kranz
 CEO
 (256) 261-1260
 mike.kranz@engeniusmicro.com
Business Contact
 Chris Heaton
Phone: (404) 382-9646
Email: chris.heaton@engeniusmicro.com
Research Institution
N/A
Abstract
Additive Manufacturing is a disruptive technology that has the ability to change how components are made, used and repaired. The past 10 years have seen a rapid increase in the availability of low cost 3d printers. The sophistication, quality and ease of use for these tools has been increasing rapidly while the cost is decreasing. There exists an emerging opportunity to combine printed electronics with traditional additive manufacturing to realize cost savings while increasing capability. Of special interest is the opportunity to embed RF components into additive manufacturing. We propose developing technology to embed RF components into additive manufacturing substrates. A key part of this research will be the development of RF connectors suitable for additive manufacturing fabrication while still meeting the requirements for RF operation. EngeniusMicro will use its RF simulation and modeling tools to develop designs of embedded RF components then fabricate and test these designs.

* Information listed above is at the time of submission. *

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