Vacuum Pressure Impregnation Insulation Systems for High Temperature Fusion Applications

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-03ER83631
Agency Tracking Number: 72336S03-I
Amount: $99,996.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
2600 Campus Drive, Suite D, Lafayette, CO, 80026
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Paul Fabian
 (303) 664-0394
Business Contact
 Naseem Munshi
Phone: (303) 664-0394
Research Institution
72336S03-I Newly designed and proposed fusion magnet systems will require electrical insulation capable of withstanding high temperatures and high doses of radiation. Due to the lack of cost effective insulation systems that meet these criteria, many new magnet systems are being designed around insulation systems that were originally intended to perform at cryogenic temperatures, thereby compromising the most efficient operation of these devices. This project will develop and formulate new organic and inorganic resin systems for use in fusion magnet insulation. Phase I will formulate and develop novel cyanate ester monomers combined with inorganic polymers, suitable for use as vacuum pressure impregnation (VPI) systems. The processing properties of the new matrix systems will be characterized, and their mechanical, electrical, and thermal properties will be evaluated after exposure to temperatures at or above 100¿C, and also at cryogenic temperatures. Commercial Applications and Other Benefits as described by awardee: New VPI insulation systems, capable of withstanding increased exposure to high temperatures with improved radiation resistance and mechanical and electrical properties, should directly affect the viability and operation of new fusion magnet designs. Improved insulation systems could potentially reduce the fabrication costs of magnet systems and extend the useful lifetime of these devices.

* Information listed above is at the time of submission. *

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