Ultra High-Speed Video Processing for High Resolution Electro-Optical Sensors
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411 North JFK Avenue, Loogootee, IN, 47553
AbstractThe Missile Defense Agency (MDA) is developing a new kill vehicle to be employed as part of a missile system upgrade program. One of the performance enhancements under consideration involves improving performance through the integration of data from three sensors, each operating in a different spectral range, with both active and passive capability. This document proposes a unique and novel approach to sensor integration through the development of a Common Video Processor Board. This innovative design receives signals from a wide variety of sensor elements over a common interface bus, pre-processes the data configurable to the sensor type connected, and provides an integrated signal to the mission computer via a high speed Industry Standard Interface. Because performance characteristics of the Common Video Processor Board are firmware defined, the board may be reprogrammed to respond to emerging threats or sensor technology enhancements. In addition to the unique aspects of active and passive sensor integration, this effort challenges the limits of on-board data processing. In order to accommodate the data rate of known and emerging sensors, the processing capability of the board approaches 7.5 Gbits/sec, approximately nine times the speed of processors currently being used.
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