Fast, High Resolution 3-D Flash LIDAR Imager

Award Information
Agency:
Department of Defense
Amount:
$69,988.00
Program:
SBIR
Contract:
N00014-10-M-0131
Solitcitation Year:
2010
Solicitation Number:
2010.1
Branch:
Navy
Award Year:
2010
Phase:
Phase I
Agency Tracking Number:
N101-083-0122
Solicitation Topic Code:
N101-083
Small Business Information
Pacific Microchip Corp.
11949 Jefferson Blvd. #105, Los Angeles, CA, 90230
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
831566877
Principal Investigator
 Denis Zelenin
 CTO
 (310) 683-2628
 denis@pacificmicrochip.com
Business Contact
 Dalius Baranauskas
Title: CEO
Phone: (310) 683-2628
Email: dalius@pacificmicrochip.com
Research Institution
N/A
Abstract
Mine and obstacle detection in very shallow water and through the surf-zone is an extremely challenging technical problem. A recent Navy system uses a 3-D LIDAR employing an image tube with a GaAsP photocathode and an anode based on a silicon PIN diode array bump bonded to a ROIC. The Navy system also uses a range-gated camera for more accurate image analysis at specific water depths. Pacific Microchip Corp. proposes replacing the two sophisticated cameras with a high resolution, light, robust, and low cost monolithic 1024 x 1024 pixel, 56 ranging bin 3-D imager. High light sensitivity, built-in anti-blooming, and wide dynamic range offer high image contrast and effective rejection of the solar and laser glints. A novel data serialization simplifies interfacing at low power consumption. A unique imager topology permits combining four focal planes to build a 4.2M pixel 3-D imager panel for future Navy missions. The proposed ASIC will be manufactured on 200mm CMOS wafers. During Phase I a circuit design and in silico validation of the imager will be provided. Phase II will result in a product ready for commercialization in Phase III.

* information listed above is at the time of submission.

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