A Revolution in Heat Conduction Software

Award Information
Agency:
Department of Defense
Amount:
$729,822.00
Program:
SBIR
Contract:
DAAH01-02-C-R009
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Army
Award Year:
2002
Phase:
Phase II
Agency Tracking Number:
A002-1396
Solicitation Topic Code:
N/A
Small Business Information
Continuum Dynamics, Inc.
34 Lexington Avenue, Ewing, NJ, 08618
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
096857313
Principal Investigator
 Alexander Boschitsch
 Associate
 (609) 538-0444
 alex@continuum-dynamics.com
Business Contact
 Barbara Agans
Title: Administrator
Phone: (609) 538-0444
Email: barbara@continuum-dynamics.com
Research Institution
N/A
Abstract
"In many applications of current and near-future interest, significant departures from Fourier's law are observed in the thermal conduction processes of engineering materials important to Army applications. Such discrepancies may result in inadequateprotection, excessive weight or premature hardware failure. To correct this, non-Fourier conduction modeling can be exploited to optimize current design tools. In particular, the dual phase lag (DPL) thermal model can be used to provide a very generaldescription for the thermal response of many materials both at the microscale and macroscale. In Phase I, we successfully developed a 1D DPL model and demonstrated potential thermal lag problems with a rocket nozzle design. In Phase II, we propose to:(i) develop a 3D finite element model of the DPL equation; (ii) construct an easy-to-use graphical interface to simplify problem set up; (iii) interface the DPL model with the ABAQUS finite element software; and (iv) conduct experiments to determine thephase lags for selected materials used by the Army. Successful completion of this effort will provide the Army with the software and material data necessary to analyze rapid thermal transients in rocket nozzles, and heat transfer in various applicationssuch as nanotechnology, laser technology, and MEMS."

* information listed above is at the time of submission.

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