Fast Curing Modular Composite Patch System for Field Applications

Award Information
Agency:
Department of Defense
Branch
Special Operations Command
Amount:
$99,960.00
Award Year:
2007
Program:
SBIR
Phase:
Phase I
Contract:
H92222-07-P-0074
Agency Tracking Number:
S071-002-0129
Solicitation Year:
2007
Solicitation Topic Code:
SOCOM07-002
Solicitation Number:
2007.1
Small Business Information
CONTINUUM DYNAMICS, INC.
34 Lexington Avenue, Ewing, NJ, 08618
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
096857313
Principal Investigator:
Andrew Kaufman
Senior Associate
(609) 538-0444
andy@continuum-dynamics.com
Business Contact:
Barbara Agans
Administrator
(609) 538-0444
barbara@continuum-dynamics.com
Research Institution:
n/a
Abstract
SOCOM requires a method to field repair multiple materials as well as to mount armor and related hardware for a variety of tactical purposes with a composite material. To address this need, we propose application of a “Modular UV Patch” (MUVP) system that incorporates ultraviolet curing resin systems and an innovative technique for delivering the UV light through optically lossy fibers that form a composite material. This patented modular patch system will be self-contained, easy to use, and provides rapid curing (seconds) while also providing a capability for underwater applications. The UV based resin systems offer increased shelf life, and elimination of special storage facilities, with a minimal “tail” of supporting equipment while maintaining the strength associated with both conventional thermal cures and competing bonding compounds. The focus of this Phase I effort is on the demonstration of a rapid strong single-step UV curing process and its assessment for damage tolerance and underwater adhesion as well as its optimization for a wide range of field applications. Comparisons with competitive sealant and adhesive compounds will also be made and an agenda determined for Phase II development of the MUVP system.

* information listed above is at the time of submission.

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