Electronic Modeling and Design for Extreme Temperatures

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$69,957.00
Award Year:
2007
Program:
SBIR
Phase:
Phase I
Contract:
NNX07CA79P
Award Id:
84010
Agency Tracking Number:
066191
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7101 Poplar Avenue, Takoma Park, MD, 20912
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
784794930
Principal Investigator:
James McGarrity
Principal Investigator
(301) 774-4379
jmcgarrityarl@yahoo.com
Business Contact:
Neil Goldsman
Business Official
(301) 270-9211
neilgoldsman@gmail.com
Research Institution:
n/a
Abstract
We propose to develop electronics for operation at temperatures that range from -230oC to +130oC. This new technology will minimize the requirements for external heat sources that are currently necessary for operation of low-temperature electronics. Such technology would significantly improve reliability, performance, lifetime of electronics that are used for space applications, including satellites and space travel. This will be achieved through the development of unique circuits that are derived from novel physics based device and circuit modeling techniques and verified by experiment. Statistical methods will be employed to connect the resistive heating caused by individual devices to heating of the entire integrated circuit. Special algorithms will be further developed which allow for determination of operating conditions where the intrinsic operation of the circuit will allow for sufficient heat generation to eliminate carrier freeze-out and efficient operation of integrated circuits in environments ranging from -230oC to +130oC. For situations where intrinsic circuit resistive heating at cryogenic temperatures is insufficient to overcome carrier freeze out, we will design on-chip micro-heaters to provide direct heating to chips at the submicron device level. Thermal modeling of packaging will also be performed. With the intrinsic temperature control established, we will design specific single electron latchup immune circuits for application extreme environments.

* information listed above is at the time of submission.

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