CAD Tool Development and Design for 3D Integrated Circuits: Optimizing Thermal Effects, Delay, Placement and Routing

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$98,915.00
Award Year:
2009
Program:
SBIR
Phase:
Phase I
Contract:
W31P4Q-09-C-0591
Award Id:
91891
Agency Tracking Number:
09SB1-0130
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7101 Poplar Avenue, Takoma Park, MD, 20912
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
784794930
Principal Investigator:
Michael Holloway
Engineer
(240) 432-6535
michael.holloway@coolcadelectronics.com
Business Contact:
Neil Goldsman
President
(240) 432-6535
neil.goldsman@coolcadelectronics.com
Research Institution:
n/a
Abstract
We plan to develop unique CAD design tools, which facilitate the design of 3D integrated circuits and circuit elements, as well as tools to predict the parasitic effects resulting from 3D integration. These CAD tools will use novel techniques to simultaneously simulate the temperature distribution and heating in a 3D IC and its effect on circuit performance; an efficient impulse response method to model the electromagnetic coupling between metal interconnects in a 3D IC, and the RC and RLC delays of interconnect network. For mixed signal 3D IC's, we will propose guidelines for the design of efficient passive circuit elements including 3D inductors and antennas. We will also develop optimized sub-circuit routing and placement algorithms that take local temperature, and RC, RL and RLC effects into account for laying out integrated circuits in 3D. We propose to design tools that enable use of standard simulation languages and layout software such as Verilog and Cadence for 3D integration. Finally, we plan to utilize our CAD tools and methodologies to design a new 3D IC that can be submitted for fabrication.

* information listed above is at the time of submission.

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