Secure Polymeric Circuit Board System

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F33615-03-C-5008
Agency Tracking Number: 021ML-2761
Amount: $748,845.00
Phase: Phase II
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
CORNERSTONE RESEARCH GROUP, INC.
2750 Indian Ripple Rd., Dayton, OH, 45440
DUNS: 130020209
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Mark Stacy
 Vice President, Operation
 (937) 320-1877
 stacyma@crgrp.net
Business Contact
 Patrick Hood
Title: President
Phone: (937) 320-1877
Email: hoodpj@crgrp.net
Research Institution
N/A
Abstract
Cornerstone Research Group, Inc., proposes to develop a Secure Polymeric Circuit Board System based on new materials in a three-part design: substrate, interconnection layer, and hard encapsulation. The new materials and circuit board design will advancethe state-of-the-art in circuit board tamper resistance, thereby forestalling exploitation of DoD electronic technology by adversaries. Current tamper resistant encapsulation methods are difficult to apply and add weight to the system. The new materialsand design will provide a higher level of tamper resistance and improve electronic performance while reducing weight. The new substrate material will achieve lower mass density than conventional materials while exhibiting better strength and dielectricproperties. The interconnection layer will camouflage circuit paths from analysis in the unlikely event that the encapsulation is breached. The encapsulation hard coat will have material properties highly resistant to mechanical, chemical, and electronicintrusion as well as acoustic and X-ray imaging. The new fabrication processes related to these new materials and design will also reduce the production cost for secure circuit boards. This project will culminate in a prototype demonstration of anoperationally relevant secure polymeric circuit board implementing the materials, fabrication processes, and design methodology brought to maturity by this development effort.

* information listed above is at the time of submission.

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