Fail-Safe Thermal Activation Components for Insensitive Munitions

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-07-C-7609
Agency Tracking Number: 053-0403
Amount: $1,093,730.00
Phase: Phase II
Program: SBIR
Awards Year: 2007
Solicitation Year: 2005
Solicitation Topic Code: MDA05-001
Solicitation Number: 2005.3
Small Business Information
2750 Indian Ripple Rd., Dayton, OH, 45440
DUNS: 130020209
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Eric Traxler
 Research Engineer
 (937) 320-1877
Business Contact
 Patrick Hood
Title: President
Phone: (937) 320-1877
Research Institution
Cornerstone Research Group, Inc. (CRG), proposes the further development of heat-activated pressure venting mechanisms actuated by shape memory polymers (SMP) for meeting insensitive munitions (IM) requirements for ammunition containers and solid rocket motors. SMP composite materials provide the same strength as conventional composites at normal operating temperatures. However, at a threshold activation temperature, these novel materials soften to a controlled modulus of elasticity and thereby allow a predictable deformation under load. In cook-off conditions, at the threshold temperature specified by the propellant type, the SMP’s transition temperature is exceeded and the SMP actuates in a controlled geometry (rather than simply melting). SMP-actuated pressure venting mechanisms coupled with conventional ammunition containers will provide failsafe venting during slow cook-offs. CRG has demonstrated the internal SMP ring as a venting system at a prototype level during Phase I. Phase II will continue the internal ring design concept for prototype testing on an analog 7-inch solid rocket motor in a slow cook-off situation, and prepare the technology for Phase III transition. By the end of Phase II slow cook-off testing, the SMP mechanism for IM will be at a Technology Readiness Level (TRL) of 6, system/subsystem model or prototype demonstration in a relevant environment.

* Information listed above is at the time of submission. *

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