SBIR Phase I: Lead-Free Sintering Adhesives for Electronics Thermal Management

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$99,998.00
Award Year:
2009
Program:
SBIR
Phase:
Phase I
Contract:
0912842
Award Id:
91109
Agency Tracking Number:
0912842
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
310 Via Vera Cruz, Suite 107, San Marcos, CA, 92078
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
827430583
Principal Investigator:
MatthewWrosch
MS
(760) 752-1192
mwrosch@creativeelectron.com
Business Contact:
MatthewWrosch
MS
(760) 752-1192
mwrosch@creativeelectron.com
Research Institute:
n/a
Abstract
This Small Business Innovation Research Phase I project will develop and characterize lead-free adhesives with very high thermal and electrical conductivity for wide bandgap semiconductor packaging. The company will build on its IP portfolio of fluxing adhesive binder systems to formulate polymer fluxes suitable for low-temperature, lead-free solders. The development of cost effective, high performance packaging systems will hasten the adoption of wide bandgap semiconductor components for high power electronic and optoelectronic applications. This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).

* information listed above is at the time of submission.

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