Sintered Conductive Adhesives for HB-LED Thermal Management

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-08ER85059
Agency Tracking Number: 85841
Amount: $99,889.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2008
Solicitation Topic Code: 08 b
Solicitation Number: DE-PS02-07ER07-36
Small Business Information
310 Via Vera Cruz, Suite 107, San Marcos, CA, 92069
DUNS: 957992522
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Matthew Wrosch
 (760) 752-4359
Business Contact
 Janet Fox
Title: Dr.
Phone: (760) 752-1192
Research Institution
Continuous improvements in high-brightness light emitting diode (HB/LED) technologies have opened up the possibility for utilization of these devices for general illumination. However, before HB/LEDs can replace traditional lighting sources, improvements to their thermal management schemes, particularly the bonding technologies that hold the device components together, must be developed to ensure consistent color quality and competitive operational lifetimes. Conductive adhesives are typically used for low-cost assembly, but these materials represent the weakest point in the thermal path. This project will develop sintered conductive adhesives that will form metallurgical bonds with the device components, providing at least an order-of-magnitude better thermal performance than existing adhesive technologies. These low-cost, lead-free materials will be designed as drop-in replacements for existing manufacturing processes. Commercial Applications and other Benefits as described by the awardee: The new materials should make an ideal replacement for silver-filled conductive adhesives in a wide variety of applications requiring thermal management, and they may ultimately replace high-lead solders in power electronics applications as well.

* Information listed above is at the time of submission. *

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