Conformal Semiconductor Circuits

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$69,125.00
Award Year:
2005
Program:
SBIR
Phase:
Phase I
Contract:
W15QKN-06-C-0015
Award Id:
73839
Agency Tracking Number:
A052-008-2069
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
4505 Spicewood Springs Road, Suite 360, Austin, TX, 78759
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
135494073
Principal Investigator:
Dennis Ferguson
RF/Microwave Engineer & Partner
(512) 795-0220
dennis.ferguson@crossfieldtech.com
Business Contact:
David Lamb
Business Development & Partner
(407) 491-6929
david.lamb@crossfieldtech.com
Research Institute:
n/a
Abstract
Crossfield proposes to develop a hybrid direct write technique for developing conformal circuits and semiconductors. Crossfield, together with Honeywell and the Massachusetts Institute of Technology (MIT) intend to demonstrate a conformal circuit technique that enables the metal elements of the circuit (such as power and signal traces or antennas) and supporting semiconductors such as bias circuits to be directly written to the conformal surface. The remaining active devices will employ a high performance semiconductor fabrication technique based on Honeywell's Silicon on Insulator (SOI) technology. SOI is well suited to the conformal circuit fabrication process and will enable digital or millimeterwave devices to be added on the previously developed metal patterns. The finished conformal circuit will be low cost, while enjoying the high performance of existing, mature semiconductor technology.

* information listed above is at the time of submission.

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