Material Utilization and Waste Reduction through Kerf Recycling

Award Information
Agency:
Department of Energy
Branch:
N/A
Amount:
$98,390.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-08ER85087
Agency Tracking Number:
N/A
Solicitation Year:
2008
Solicitation Topic Code:
24 b
Solicitation Number:
DE-PS02-07ER07-36
Small Business Information
Crystal Systems, Inc.
27 Congress Street, Salem, MA, 01970
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
062191275
Principal Investigator
 David Joyce
 Dr.
 (978) 745-0088
 djoyce@crystalsystems.com
Business Contact
 Leila Panzner
Title: Ms.
Phone: (978) 745-0088
Email: leila@crystalsystems.com
Research Institution
N/A
Abstract
Material utilization and waste reduction are primary concerns during the manufacture of solar cells and wafers. This project will develop a processing method, Fixed Abrasive Slicing Technology (FAST), in which the silicon lost to the slurry during wafer sawing can be recycled. This loss represents a huge waste of scarce silicon as well as the largest waste stream generated by solar cell wafer production. The recyclable silicon swarf produced by FAST slicing will be processed into solar grade feedstock. In Phase I, the FAST technology will be used to slice silicon and the swarf silicon will be tested. Then, this type of swarf will then be processed into solar grade silicon feedstock. Commercial Applications and other Benefits as described by the awardee: The technology should result in a reduction in wasted silicon, which would translate into an enormous increase in the supply of silicon. This increase in supply would allow the industry to grow, while reducing the waste stream generated by the industry.

* information listed above is at the time of submission.

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