Lead-free Solder Alternative Interconnect Material

Award Information
Agency:
Department of Defense
Branch:
Air Force
Amount:
$99,490.00
Award Year:
2010
Program:
SBIR
Phase:
Phase I
Contract:
FA8650-10-M-5120
Agency Tracking Number:
F093-111-2537
Solicitation Year:
2009
Solicitation Topic Code:
AF093-111
Solicitation Number:
2009.3
Small Business Information
TPF Enterprises LLC
2771 W Lake Rd, Wilson, NY, 14172
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
831053116
Principal Investigator
 Alan Rae
 Managing Member
 (716) 791-1084
 alan@tpfenterprises.us
Business Contact
 Alan Rae
Title: Managing Member
Phone: (716) 791-1084
Email: alan@tpfenterprises.us
Research Institution
N/A
Abstract
Nano silver-coated copper pastes will be prepared and evaluated as an economic alternative to tin-lead or tin-silver copper paste for improved processability, properties and reliability combined with compatibitibility with legacy components and solder systems. BENEFIT: Compared with current lead-free solder systems these nano silver coated copper pastes will provide a lower processing temperature equivalent to tin-lead solder, acceptable economics, compliant and lightweight joints and compatibility with legacy and anticipated components and boards. The joints do not contain low-melting alloys subject to creep constraints at equipment operating temperatures, contain abundant metals and will be field processable with existing production and rework equipment.

* information listed above is at the time of submission.

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