- Award Details
Lead-free Solder Alternative Interconnect Material
Department of Defense
Agency Tracking Number:
Solicitation Topic Code:
Small Business Information
TPF Enterprises LLC
2771 W Lake Rd, Wilson, NY, 14172
Socially and Economically Disadvantaged:
AbstractNano silver-coated copper pastes will be prepared and evaluated as an economic alternative to tin-lead or tin-silver copper paste for improved processability, properties and reliability combined with compatibitibility with legacy components and solder systems. BENEFIT: Compared with current lead-free solder systems these nano silver coated copper pastes will provide a lower processing temperature equivalent to tin-lead solder, acceptable economics, compliant and lightweight joints and compatibility with legacy and anticipated components and boards. The joints do not contain low-melting alloys subject to creep constraints at equipment operating temperatures, contain abundant metals and will be field processable with existing production and rework equipment.
* information listed above is at the time of submission.