High conductivity CNT wiring for high speed data cables

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-16-C-5017
Agency Tracking Number: F151-130-1865
Amount: $749,830.00
Phase: Phase II
Program: SBIR
Awards Year: 2016
Solicitation Year: 2016
Solicitation Topic Code: AF151-130
Solicitation Number: 2015.1
Small Business Information
2429 Bissonnet St, Houston, TX, 77005
DUNS: 079716398
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr. Alberto Goenaga
 (805) 895-8628
 alberto@dexmat.com
Business Contact
 Dr. Alberto Goenaga
Phone: (805) 895-8628
Email: alberto@dexmat.com
Research Institution
N/A
Abstract
In an era of reduced Defense budgets and increasing threats, military planners are seeking new technologies to reduce operating costs and increase operation capabilities for space and aviation platforms, and weight reduction is an attractive target. For example, transportation costs to geosynchronous orbits using a NASA reusable launch vehicle are close to $10,000 per pound of payload. Copper wiring, which makes up as much as one-third of the weight of a 15-ton satellite and 20 miles of an F-22 aircraft, is a clear target for weight reduction. Half of this wire weight is typically in the EMI shielding. Developing new lightweight, conductive materials that replace copper in the shielding and core conductor could serve as a lead candidate for radically reducing this weight. Carbon nanotubes (CNTs) combine high strength, electrical and thermal conductivity with low density, which makes them ideal for applications where weight reduction is a priority. DexMat is commercializing CNT technology that has shown the highest published values for conductivity and mechanical strength of CNT materials. This Phase II Proposal will continue developing CNT-based cables with solution-processing technology capable of producing high performance CNT fibers and coatings, without the use of binders and wetting agents.

* Information listed above is at the time of submission. *

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