Diamonite(TM)-bonded C/C Composite for Thermal Protection of Re-entry Bodies

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NAS1-03045
Agency Tracking Number: 023858
Amount: $70,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
120 Centennial Ave., Piscataway, NJ, 08854
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Oleg A. Voronov
 Principal Investigator
 (732) 885-0805
Business Contact
 Gary S. Tompa
Title: President
Phone: (732) 885-0805
Email: gstompa@aol.com
Research Institution
We propose to develop a lightweight, heat-resistant Diamonite(TM)-bonded C/C composite for thermal protection of re-entry vehicles. Our previous work has shown that nanostructured carbon produced by pressure-assisted polymerization of mixed fullerenes creates a new high specific strength carbon material called Diamonite(TM), which has mechanical properties closer to diamond than to graphite. Building on this experience, in Phase I, we will pressure infiltrate a woven fiber carbon preform with mixed fullerenes, and transform the infiltrated material into Diamonite(TM), thereby forming a Diamonite(TM)-bonded C/C composite. The fiber architecture can be computer designed to match the performance requirements of the shielding material. In Phase I, the best parameters for pressure-assisted polymerization of the new composite material and an optimal reinforcing fibrous structure will be determined. We will machine experimental samples and determine the value of specific strength, thermal stability, and other properties needed for the design of an optimal thermal protection system. In Phase II, we will determine the conditions for scaling the process and fabrication of a prototype thermal protection shield, which can be evaluated by Lockheed Martin. The manufacturing of new material and protection parts will be established in Phase III.

* Information listed above is at the time of submission. *

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