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Smart Readout Integrated Circuit for Dual Band Infrared Focal Plane Arrays

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-17-C-7342
Agency Tracking Number: B2-2526
Amount: $998,440.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: MDA15-019
Solicitation Number: 2015.3
Solicitation Year: 2015
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-08-03
Award End Date (Contract End Date): 2019-08-02
Small Business Information
5383 Hollister Ave.
Santa Barbara, CA 93111
United States
DUNS: 831934414
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Kenton Veeder
 (805) 617-0337
Business Contact
 Kenton Veeder
Phone: (805) 617-0337
Research Institution

This proposal outlines a large-format small-pitch low-power digital pixel readout integrated circuit (DPROIC) for dual-band infrared focal plane arrays to achieve high sensitivity, high resolution, large dynamic range, low noise, large field of view and fast data rate. This digital pixel readout will be a complete camera-on-chip architecture when combined with single or dual polarity dual band detectors in a hybrid fashion. It will have a wide operating temperature range from cryogenic to room temperature to support a broad range of detector architectures. This readout circuit will also be radiation tolerant to survive harsh man-made and natural radiation environments, including high energy particles and photons to prevent catastrophic system failure. The proposed DPROIC will be implemented in a mature complementary metal-oxide-semiconductor (CMOS) process with much more reasonable mask costs as compared to that of state-of-the-art line width processes, saving the government money and broadening the possible supplier base. The final product will be flexible enough to be used as a generic readout integrated circuit for a broad range of missile defense applications. Approved for Public Release | 17-MDA-9219 (31 May 17)

* Information listed above is at the time of submission. *

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