Ultra-High Thermally Conductive, Dielectric, Conformable Thermal Interface Materials for Energy Storage & Power Systems Thermal Management

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-17-C-0420
Agency Tracking Number: N171-081-0237
Amount: $124,999.00
Phase: Phase I
Program: SBIR
Awards Year: 2017
Solicitation Year: 2017
Solicitation Topic Code: N171-081
Solicitation Number: 2017.1
Small Business Information
8100 Shaffer Parkway, Littleton, CO, 80127
DUNS: 148034408
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Sayangdev Naha
 (303) 874-8275
Business Contact
 James Budimlya
Phone: (303) 792-5615
Email: jim.budimlya@adatech.com
Research Institution
To prevent the well-known potentially hazardous nature of lithium ion (Li-ion) batteries operated at high rates and high duty cycles for current and future Navy shipboard and ground applications, ADA Technologies proposes to develop a highly thermally conductive and simultaneously highly dielectric conformable thermal interface material (TIM) to enable novel thermal management design for cell-to-pack level heat removal in large-format Li-ion batteries. The TIM pad/film will be designed and tested to ensure no pump-out will occur under vibration, thermal and power/duty cycling, when utilized in energy storage and power electronics platforms for Navy and other DoD applications. ADAs proposed TIM will be designed to provide effective thermal interface between cells and a battery cooling module developed by our partner for Navy ship and terrestrial applications, including but not limited to next-generation weapons systems. Our TIMs and integration protocols will be designed to integrate with external active cooling loops already utilized by Navy (shipboard and other) battery platforms, ensuring a drop-in replacement requiring minimum assembly complications. We plan to leverage our decade-long expertise in the design, manufacturing and fabrication of TIMs to solve this unique need.

* Information listed above is at the time of submission. *

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