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High Production Rate Nanocomposite Film Capacitors

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-18-C-0031
Agency Tracking Number: N172-128-0506
Amount: $224,873.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N172-128
Solicitation Number: 2017.2
Solicitation Year: 2017
Award Year: 2018
Award Start Date (Proposal Award Date): 2017-10-10
Award End Date (Contract End Date): 2018-01-17
Small Business Information
2600 Campus Drive, Suite D
Lafayette, CO 80026
United States
DUNS: 161234687
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Andrea Haight
 (303) 664-0394
Business Contact
 Lori Bass
Phone: (303) 664-0394
Research Institution

Dielectric materials, which store energy electrostatically, are ubiquitous in advanced electronics and electric power systems. Polymer dielectrics have highbreakdown strengths and excellent reliability, are scalable, lightweight and can be shaped into intricate configurations, and are therefore an ideal choice for many power electronics, power conditioning, and pulsed power applications. A variety of high-performance engineering polymers have been considered as possible high-temperature dielectric materials to address these urgent needs. These materials perform reasonably well at high temperatures but only under relatively low electric fields; there has been only limited success when the material is subject to both high temperatures and high voltages. It has been shown that improving thermal conductivity of the polymer film dielectrics vastly improves performance, but scalability remains an issue.Composite Technology Development, Inc. (CTD), in collaboration with Dr. Qing Wang and Carestream Contract Manufacturing is proposing to develop a polyimide-based nanocomposite film dielectric that will exhibit performance meeting or exceeding the desired performance targets and can be produced using an industry-standard roll-to-roll production process.

* Information listed above is at the time of submission. *

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