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Thermal Management of Highly Integrated Radio Frequency (RF) Electronics

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-17-C-0270
Agency Tracking Number: N111-023-0608a
Amount: $1,806,599.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N111-023
Solicitation Number: 2011.1
Solicitation Year: 2011
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-03-21
Award End Date (Contract End Date): 2019-01-31
Small Business Information
5340 Airport Blvd.
Boulder, CO 80301
United States
DUNS: 125961123
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr. Luke Sankey
 Senior RF Engineer
 (303) 449-5211
Business Contact
 Jeanne Hill-Jurik
Phone: (303) 449-5211
Research Institution

Sophisticated radar antennas such as an active electronically scanned aperture (AESA) are used to support acquisition and tracking in multiple modes over wide bandwidths, monopulse tracking, and Sense and Avoid RADAR (SAA) for UAV applications. These multi-function radar systems are small but require a considerable amount of power, which in turn produces a significant amount of heat. For these systems to be practical they must be lightweight and affordable while managing thermal loads to meet mission critical levels of reliability and performance. System weight, performance, and reliability are all positively impacted by having an efficient thermal management approach.During the phase II base effort, FIRST RF has substantially advanced the level of maturity of the array architecture described in the proposal. This architecture allows for intimate integration of the thermal management system, which is a problem in traditional phased array approaches. To demonstrate and mature this technology, we have focused on the particular design case of a lightweight, planar radar aperture. During the phase II.5 program, the array architecture and thermal management approach will be demonstrated through fabrication and test of a phased array radar system operating at high RF power density.

* Information listed above is at the time of submission. *

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