Optical "Bond Pads" For Silicon VLSI

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 19700
Amount: $59,088.00
Phase: Phase I
Program: SBIR
Awards Year: 1993
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
2200 Central Avenue, Boulder, CO, 80301
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Mark Handschy
 (303) 449-8933
Business Contact
Phone: () -
Research Institution
N/A
Abstract
WE PROPOSE A NOVEL METHOD FOR PROVIDING OPTICAL MODULATOR PADS ON SILICON VLST CIRCUITS. OUR TECHNIQUE SHOULD ENABLE MODULATOR PAD ARRAYS OF NEARLY ARBITRARY CONFIGURATION, WITH MINIMUM PAD GEOMETRIES OF A FEW MICRONS SQUARE. MODULATOR RESPONSE TIMES LESS THAN 1 ns SHOULD BE ACHIEVED. THE TECHNIQUE REQUIRES ONLY A FEW PROCESS STEPS AND WILL WORK ON CIRCUITS MADE IN ANY STANDARD VLSI PROCESS.

* Information listed above is at the time of submission. *

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