Optical "Bond Pads" For Silicon VLSI

Award Information
Agency:
Department of Defense
Branch:
Missile Defense Agency
Amount:
$59,088.00
Award Year:
1993
Program:
SBIR
Phase:
Phase I
Contract:
N/A
Agency Tracking Number:
19700
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Displaytech, Inc.
2200 Central Avenue, Boulder, CO, 80301
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 Mark Handschy
 (303) 449-8933
Business Contact
Phone: () -
Research Institution
N/A
Abstract
WE PROPOSE A NOVEL METHOD FOR PROVIDING OPTICAL MODULATOR PADS ON SILICON VLST CIRCUITS. OUR TECHNIQUE SHOULD ENABLE MODULATOR PAD ARRAYS OF NEARLY ARBITRARY CONFIGURATION, WITH MINIMUM PAD GEOMETRIES OF A FEW MICRONS SQUARE. MODULATOR RESPONSE TIMES LESS THAN 1 ns SHOULD BE ACHIEVED. THE TECHNIQUE REQUIRES ONLY A FEW PROCESS STEPS AND WILL WORK ON CIRCUITS MADE IN ANY STANDARD VLSI PROCESS.

* information listed above is at the time of submission.

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