Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)

Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00178-18-C-7000
Agency Tracking Number: N161-052-0852
Amount: $987,189.00
Phase: Phase II
Program: SBIR
Awards Year: 2018
Solicitation Year: 2016
Solicitation Topic Code: N161-052
Solicitation Number: 2016.1
Small Business Information
1000 A Pannell Street, Columbia, MO, 65201
DUNS: 808369792
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Corey Wilson
 (573) 397-6912
 corey.wilson@thermavant.com
Business Contact
 Joe Boswell
Phone: (573) 397-6912
Email: joe.boswell@thermavant.com
Research Institution
N/A
Abstract
Electrical systems are being designed with ever increasing power densities, particularly future radar and electronic warfare systems built with Gallium Nitride on Silicon Carbide Monolithic Integrated Circuits (GaN MMICs). Todays GaN MMICs use solid metal, low-coefficient of thermal expansion heat spreaders (e.g., Copper-Tungsten). But solid-state heat spreaders cannot meet the size, weight, power and cooling requirements of next-generation GaN MMIC applications without undesirable tradeoffs. ThermAvant proposes to efficiently diffuse high heat fluxes from GaN MMICs using micro-loop Oscillating Heat Pipes (OHPs). OHPs are a passive, two-phase heat transfer technology capable of handling very high heat fluxes using a wide range of material-fluid combinations. This specific effort aims to miniaturize OHP features to effectively dissipate tens-to-hundreds of Watts from millimeter-scale GaN devices. ThermAvant will work with the Navy and system integrators to ensure the to-be-developed micro-loop OHP spreaders meet the thermal-mechanical requirements of real-world radar/electronic systems as well as economic and manufacturing specifications.

* Information listed above is at the time of submission. *

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