Additive Manufactured Smart Structures with Discrete Embedded Sensors

The purpose of this proposal is to additively manufacture (AM) smart structures with embedded electronics such as sensors, accelerometers, antennas, etc. The goal of these smart structures will be to enhance the effectiveness and survivability of the Armys ground systems. The use of additive manufacturing smart structures provides flexibility in the materials used and the functionality of the electronics. Triton Systems plans to demonstrate the feasibility of embedding electronic sensing PCBs into the AM process, optimize the processing parameters to create a rugged product, and integration into metallic structures for Phase I. Integration of sensors and feedback loops will enable the interruption and addition of external parts (PCBs) during the AM process, without damaging the PCB or the final AM produced structure. Building upon Phase I results, the Phase II effort will include scaling up the processes to create a prototype system capable of fabricating 12 x 12 x 6 packages with improved electronic capability. During Phase III, effort will be focused on the process control and qualification of the prototype system, and the parts fabricated. A commercialization strategy and certification for integration into several vehicle platforms will also be developed.