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Direct Measurement of Bondline Temperature During Composite Repair/Fabrication

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-17-C-5059
Agency Tracking Number: F161-115-0047
Amount: $720,766.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: AF161-115
Solicitation Number: 2016.1
Timeline
Solicitation Year: 2016
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-07-17
Award End Date (Contract End Date): 2019-10-17
Small Business Information
P.O. Box 1696, Norman, OK, 73070
DUNS: 786228114
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Thomas Rose
 President
 (405) 360-4848
 admin@avproinc.com
Business Contact
 Thomas Rose
Phone: (405) 360-4848
Email: admin@avproinc.com
Research Institution
N/A
Abstract
Achieving desired bondline temperatures is critical to ensuring proper wetting, flow and cure when repairing composite structures. Under this multi-phase SBIR project a novel method for measuring/managing cure temperature in the bondline is being pursued based on patented amorphous microwire temperature sensors that are placed permanently within the bondline and read remotely via low-frequency electromagnetic interrogation. The interrogated microwire sensors provide a sharp, distinguishable voltage pulse to a remote antenna whose integrated area is directly proportional to sensor temperature. More than one microwire per sensor provides self-calibration and signal normalization. Preliminary and Phase I development of the microwire sensors and reader system prove its ability to remotely measure the temperature of a sensor permanently embedded within more than one inch of carbon fiber-reinforced polymer. Furthermore, testing to date has shown that the sensor does not present a critical flaw in the composite structure. For the USAF Phase II SBIR project proposed here we intend to validate the accuracy/precision of our novel microwire temperature measurement via a working prototype of a hot bonder accessory. It will provide feedback for closed-loop temperature control based upon temperatures within the bondline, with the goal of improving usability and providing significant time/cost savings.

* Information listed above is at the time of submission. *

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