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Super-Efficient Mid-Infrared Quantum Cascade Lasers with Continuous-Wave Wall-Plug Efficiencies in Excess of 40%

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-17-C-0466
Agency Tracking Number: N17A-006-0059
Amount: $224,955.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N17A-T006
Solicitation Number: 2017.0
Solicitation Year: 2017
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-06-08
Award End Date (Contract End Date): 2018-10-22
Small Business Information
200 N. Prospect Ave.
Madison, WI 53726
United States
DUNS: 829814925
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dan Botez
 (608) 213-5483
Business Contact
 Robert Marsland
Phone: (608) 216-6920
Research Institution
 University of Wisconsin - Madison
 Kim Moreland
Research and Sponsored Program 21 N. Park Street, Suite 6401
Madison, WI 53715
United States

 (608) 262-3822
 Nonprofit College or University

The technical objectives of this proposal are: 1) perform a comprehensive simulation of 4.6 micron-emitting quantum cascade lasers (QCLs) with suppressed carrier leakage and efficient carrier extraction to design a device with pulsed wall-plug efficiency > 40 %; 2) perform a thermal analysis of 4.6 micron-emitting QCLs to design structures capable of operating with > 40 % continuous-wave (CW) wall-plug efficiency at room temperature; 3) establish the key material- and device-related parameters for high-performance, 4.6 micron-emitting QCLs. QCLs will be designed to substantially suppress carrier leakage out of their active regions and achieve fast carrier extraction from their active regions. Novel thermal management approaches will be designed in order to minimize the overall thermal conductance of the packaged device. The design will be for over 40 % CW wall-plug efficiency at 4.6-micron wavelength, in a structure to eventually be suitable for multi-watt CW operation with a high-quality beam pattern.

* Information listed above is at the time of submission. *

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